Microstaq's Disruptive Technology
At the heart of all of Microstaq’s products is the Ventilum™ chip. This technology advances electronic valves capabilities, featuring cutting edge micro electromechanical systems (MEMS) design and process techniques. Ventilum™ architecture originated in the automotive industry, where automotive researchers set out to incorporate the lightweight, compact and robust capabilities of silicon material into high pressure, high temperature applications. Ventilum™, which initially targeted the severe environment of anti-lock braking systems, succeeding in producing a low power, fast response, high pressure and temperature capable valve.
Basic Structure: The basic structure of the Ventilum™ chip is a three layer, sliding plate silicon valve design. The top silicon layer includes electrical interconnection interface “ports” and also serves as a cover to the sliding plate mechanism. The center layer includes the thermal actuator and the sliding plate mechanism. The bottom layer consists of the flow ports and the other cover of the sliding plate mechanism. The thermal actuator moves the sliding plate over the fixed- position ports in the bottom cover, thus creating a valve.
Thermal Actuation: Ventilum™ technology leverages the highly accurate and repeatable tunability of silicon wafer resistivity. The Ventilum™ chip is actuated by applying current to one of three silicon layers which heats through resistance. The heat generated by the resistivity of the silicon causes thermal expansion of the silicon. The thermal expansion of the silicon provides the force and the mechanical motion required to open and close a valve. The heating, and therefore the movement of the silicon can be controlled very closely. The linearity of motion is limited only by how tightly the application of current can be controlled.
Direct-Acting Valve
High Pressure: Ventilum™ technology includes innovative pressure balancing techniques which make high pressure operation possible. Ventilum™ was designed to target operation from 2,000 to 3,000 psi, and has achieved consistent operation at 1,500 psi.
High Temperature: The Ventilum™ chip is all silicon and can operate in a wide temperature range. The silicon device is fabricated in extremely high temperature processes and can easily operate in standard industrial range: -40°C to 150°C. Temperature requirements outside of this range can be accommodated on a case by case basis.
Spool Valve
Valve Configurations: The Ventilum™ architecture includes two basic valve types: direct-acting and pilot/spool.
Direct-Acting: Direct-acting Ventilum™ chips include the thermal actuator and valve ports based on customer requirements. The standard direct-acting Ventilum™ design incorporates three ports: one normally open, one normally closed and one common port. When the valve is powered off the main flow can enter the valve from either the normally open, or normally closed port and exit the valve via the common port.
Pilot/Spool: The pilot/spool valve is also standard in a normally actuated valve configuration. The spool valve is a hydraulically actuated slave valve that amplifies the flow capacity of the thermally actuated direct-acting Ventilum™ chip. The standard spool valve design consists of a two-port main flow valve and a command and feedback port system through which the direct-acting valve controls the spool valve movements. Utilizing proprietary patent-pending Microstaq technology the spool valve can be configured so the spool valve exactly mimics the linear movements of the direct-acting valve. In a different configuration, the spool valve precisely matches outgoing pressure to the incoming pressure signal. The direct-acting valve provides the hydraulic “signal” to the spool valve.
Technology Evolution: Microstaq's innovative technology has allowed for the development of the Silicon Expansion Valve which moves far beyond the capabilities of traditional capillary tubes and Thermostatic Expansion Valves (TXVs), as well as newer Pulse Motor Valves (PMVs).
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